DocumentCode
3773258
Title
Miniature explosive bonding for electrical interconnections
Author
B. H. Cranston
Author_Institution
Western Electric, Engineering Research Center, Princeton, New Jersey
fYear
1973
Firstpage
202
Lastpage
204
Abstract
Although explosive energy has been used for a number of years to produce large scale, solid phase bonds, its small scale use entails unique problems. Current studies have dealt with these problems, producing a safe, reliable bonding method scaled to the needs of the electronics industry.
Keywords
"Explosives","Bonding","Solids","Reliability","Copper","Nickel"
Publisher
ieee
Conference_Titel
Electrical Insulation Conference, 1973 EIC 11th
Print_ISBN
978-1-5090-3110-8
Type
conf
DOI
10.1109/EIC.1973.7468685
Filename
7468685
Link To Document