Title :
New laminates for printed circuit boards
Author :
Kohtaro Yanagihara;Soji Sugie;Morio Gaku
Author_Institution :
Fujitsu Laboratories Ltd., Kawasaki, Japan
Abstract :
The rapid progress in reliability and performance of electronic equipment in recent years calls for further improvement in circuit density, reliability and electrical properties of printed circuit boards on which IC or LSI is installed. This problem can be solved only by new development in such as board material, plating, and manufacturing process and technologies.
Keywords :
"Laminates","Copper","Plating","Aluminum","Rough surfaces","Surface roughness"
Conference_Titel :
Electrical Insulation Conference, 1973 EIC 11th
Print_ISBN :
978-1-5090-3110-8
DOI :
10.1109/EIC.1973.7468687
