DocumentCode :
3773268
Title :
Characterization of Kapton® polyimide film for use in flexible circuitry
Author :
John A. Kreuz
Author_Institution :
Circleville Technical Section, Industrial Film Division, Film Department, E.I. Du Pont de Nemours &
fYear :
1973
Firstpage :
231
Lastpage :
233
Abstract :
In addition to its excellent insulating properties, non-flammability, and resistance to solvents, Kapton® polyimide film possesses a high degree of thermal and mechanical toughness to withstand flexible circuitry processing conditions. It has, therefore, found application in flexible flat cables,1 multi-layers,2 IC chip carriers,3 and even in printed circuits of the Polaroid SX-70 and Kodak XL-33, XL-55 cameras4.
Keywords :
"Films","Etching","Adhesives","Copper","Humidity","Testing","Temperature measurement"
Publisher :
ieee
Conference_Titel :
Electrical Insulation Conference, 1973 EIC 11th
Print_ISBN :
978-1-5090-3110-8
Type :
conf
DOI :
10.1109/EIC.1973.7468695
Filename :
7468695
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=3773268
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