Panels and pins, production and perfection (The AMP "select solder" approach)

Today´s trend toward "hybrid packaging" of electronic assemblies - a combination of multiple layers of mother boards and point-to-point wiring - has focused attention on methods of mass attachment of interconnect posts to printed circuit boards. In "hybrid packaging" these posts play a vital role in providing connections between boards and interconnections to other components in the system. Normally, posts are inserted through the board and make contact to voltage planes, ground planes and signal traces by mechanical interference force-fitting, or by soldering. Additional interconnections can then be made to the posts using wrapped wire techniques or TERMI-POINT clip terminations*.