Title :
Electrical performance of pin-connected stacked backplanes
Author :
W. H. Knausenberger
Author_Institution :
Bell Laboratories, Whippany, New Jersey
Abstract :
Multilayer test boards have been fabricated into Stack-Assembled Multiple Multilayer (SAMM) backplane structures. Their crosstalk behavior, signal lead characteristic impedance, and the discontinuities caused by interboard vias have been characterized as a function of the separation between boards.
Keywords :
"Backplanes","Crosstalk","Pins","Impedance","Inductance","Nonhomogeneous media","Lead"
Conference_Titel :
Electrical Insulation Conference, 1973 EIC 11th
Print_ISBN :
978-1-5090-3110-8
DOI :
10.1109/EIC.1973.7468700
