Conditioning and packaging factors in stripline performance

The studies reported in this paper were undertaken to determine: 1. The variation with temperature of apparent dielectric constant and dissipation factor of copper clad TFE-glass. 2. The feasibility of bonding stripline circuit boards together with thermoplastic, pressure sensitive, or thermosetting bonding films in order to eliminate clamping variations inherent in the use of eyelets and screws and to eliminate the weight of screws and clamping plates. 3. The effect of thermocycling, mechanical vibration, and humidity on the stability of apparent dielectric constant of packages bonded by various methods.