Cost-effective and reliable hybrid circuit assembly

This report discusses the assembly of hybrid circuits for large microwave packages. Emphasis is placed on materials compatibility and process integrity. Particular attention is given to the differences in coefficients of thermal expansion and the use of stress relief between dissimilar materials. The author stresses the importance of Process Engineering involvement, considering first the end-product hardware package design, then adapting to that design the designs and processes necessary to produce the product´s components, beginning with the hybrid substrate. The report proposes a model for examination of discrete component mounting and the factors affecting microwave unit assembly.