Title :
Effective use of epoxy adhesives in microelectronic
Author_Institution :
The Johns Hopkins University, Applied Physics Laboratory, Silver Spring, Maryland 20910
Abstract :
The increasing use of epoxy in microelectronic applications brings up more frequent conflicts between those who are biased against its use and those who are convinced that it is the only way to go. The purpose of this paper is to separate facts from rumor and opinion to normalize this variance.
Keywords :
"Microelectronics","Schedules","Surface treatment","Curing","Cleaning","Surface contamination","Heating"
Conference_Titel :
Electrical Insulation Conference, 1973 EIC 11th
Print_ISBN :
978-1-5090-3110-8
DOI :
10.1109/EIC.1973.7468730
