• DocumentCode
    3773303
  • Title

    Effective use of epoxy adhesives in microelectronic

  • Author

    D. D. Zimmerman

  • Author_Institution
    The Johns Hopkins University, Applied Physics Laboratory, Silver Spring, Maryland 20910
  • fYear
    1973
  • Firstpage
    330
  • Lastpage
    332
  • Abstract
    The increasing use of epoxy in microelectronic applications brings up more frequent conflicts between those who are biased against its use and those who are convinced that it is the only way to go. The purpose of this paper is to separate facts from rumor and opinion to normalize this variance.
  • Keywords
    "Microelectronics","Schedules","Surface treatment","Curing","Cleaning","Surface contamination","Heating"
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation Conference, 1973 EIC 11th
  • Print_ISBN
    978-1-5090-3110-8
  • Type

    conf

  • DOI
    10.1109/EIC.1973.7468730
  • Filename
    7468730
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3773303