• DocumentCode
    3773310
  • Title

    Fingerprinting resin cure with dielectric analysis

  • Author

    Robert J. Onufer;Stanley A. Yalof

  • Author_Institution
    Haake, Inc. Saddle Brooke, N.J.
  • fYear
    1973
  • Firstpage
    347
  • Lastpage
    349
  • Abstract
    This paper describes a unique new approach to characterizing polymer cure by monitoring the accompanying changes in dielectric properties. The instrument, called AUDREY®2 (short for Automatic DielecRomEtrY) uses a capacitative probe to track the cure characteristics. Hence, dielectric analysis can be performed either on materials in a standard test cell for qualifying incoming resins or, alternately, in dies and molds so that it can be used for on-line measurement of these materials during their final forming operations.
  • Keywords
    "Dielectrics","Temperature","Polymers","Dielectric measurement","Resins","Temperature measurement","Time-domain analysis"
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation Conference, 1973 EIC 11th
  • Print_ISBN
    978-1-5090-3110-8
  • Type

    conf

  • DOI
    10.1109/EIC.1973.7468737
  • Filename
    7468737