DocumentCode
3773310
Title
Fingerprinting resin cure with dielectric analysis
Author
Robert J. Onufer;Stanley A. Yalof
Author_Institution
Haake, Inc. Saddle Brooke, N.J.
fYear
1973
Firstpage
347
Lastpage
349
Abstract
This paper describes a unique new approach to characterizing polymer cure by monitoring the accompanying changes in dielectric properties. The instrument, called AUDREY®2 (short for Automatic DielecRomEtrY) uses a capacitative probe to track the cure characteristics. Hence, dielectric analysis can be performed either on materials in a standard test cell for qualifying incoming resins or, alternately, in dies and molds so that it can be used for on-line measurement of these materials during their final forming operations.
Keywords
"Dielectrics","Temperature","Polymers","Dielectric measurement","Resins","Temperature measurement","Time-domain analysis"
Publisher
ieee
Conference_Titel
Electrical Insulation Conference, 1973 EIC 11th
Print_ISBN
978-1-5090-3110-8
Type
conf
DOI
10.1109/EIC.1973.7468737
Filename
7468737
Link To Document