Title :
Encapsulation by transfer moulding
Author :
Russell H. Smith
Author_Institution :
Hysol International, London, England
Abstract :
This paper is designed for the component manufacturer. It will cover some of the latest developments in the encapsulation of electronic and electrical components, using low pressure transfer moulding.
Keywords :
"Coils","Transistors","Capacitors","Resistance","Encapsulation","Transfer molding","Humidity"
Conference_Titel :
Electrical Insulation Conference, 1967 Seventh
Print_ISBN :
978-1-5090-3106-1
DOI :
10.1109/EIC.1967.7468808
