Title :
3-D stacking tutorial introduction
Abstract :
This article consists of a collection of slides from the author´s conference presentation. Presents a tutorial of three-dimensional (3D) stacking. Some of the specific topics discussed include: a description of 3D stacking technologies; design considerations; cost considerations; system implications; and future areas of development.
Keywords :
"Field programmable gate arrays","Stacking","Tutorials","Foundries","Mobile communication","Graphics processing units","Integrated optics"
Conference_Titel :
Hot Chips 24 Symposium (HCS), 2012 IEEE
DOI :
10.1109/HOTCHIPS.2012.7476470
