• DocumentCode
    3774584
  • Title

    Foundry TSV enablement for 2.5D/3D chip stacking

  • Author

    Remi Yu

  • fYear
    2012
  • Firstpage
    1
  • Lastpage
    31
  • Abstract
    This article consists of a collection of slides from the author´s conference presentation on foundry TSV enablement for 2D/3D chip stacking. Some of the specific topics discussed include: logic design and networking infrustructures; memory stacking; examples of applications supported by this stacking methods; cost benefit analysis of three-dimensional integrated circuit investments; processing technologies; CMOS impact and evaluation; ecosystem work flows; and product reliability.
  • Keywords
    "Stacking","Field programmable gate arrays","Ecosystems","Three-dimensional displays","Field programmable gate arrays","Product design","Mobile communication","System logic","Foundries"
  • Publisher
    ieee
  • Conference_Titel
    Hot Chips 24 Symposium (HCS), 2012 IEEE
  • Type

    conf

  • DOI
    10.1109/HOTCHIPS.2012.7476471
  • Filename
    7476471
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3774584