Abstract :
This article consists of a collection of slides from the author´s conference presentation on foundry TSV enablement for 2D/3D chip stacking. Some of the specific topics discussed include: logic design and networking infrustructures; memory stacking; examples of applications supported by this stacking methods; cost benefit analysis of three-dimensional integrated circuit investments; processing technologies; CMOS impact and evaluation; ecosystem work flows; and product reliability.
Keywords :
"Stacking","Field programmable gate arrays","Ecosystems","Three-dimensional displays","Field programmable gate arrays","Product design","Mobile communication","System logic","Foundries"
