DocumentCode :
3774639
Title :
Gold sponsor
fYear :
2008
Firstpage :
1
Lastpage :
1
Abstract :
The conference organizers greatly appreciate the support of the various corporate sponsors listed.
Publisher :
ieee
Conference_Titel :
Hot Chips 20 Symposium (HCS), 2008 IEEE
Type :
conf
DOI :
10.1109/HOTCHIPS.2008.7476529
Filename :
7476529
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=3774639
