Title :
The chip design game at the end of Moore´s law
Author_Institution :
Microsystems Technology Office, DARPA, United States
Abstract :
Presents a collection of slides covering the following topics: Moore´s Law; computer design; neighboring technologies; and chip designers algorithm.
Keywords :
"Silicon","Chip scale packaging","Moore´s Law","Market research","Microarchitecture"
Conference_Titel :
Hot Chips 25 Symposium (HCS), 2013 IEEE
DOI :
10.1109/HOTCHIPS.2013.7478302
