DocumentCode :
3775150
Title :
Going to the wire: The next generation financial risk management platform
Author :
Ari Studnitzer;Oskar Mencer
Author_Institution :
Platform Development, CME Group, United States
fYear :
2013
Firstpage :
1
Lastpage :
26
Abstract :
Presents a collection of slides covering the following topics: financial risk management platform; CME Group; exchange sector; financial industry; FPGA dataflow engines; multiscale dataflow computer; dataflow box programming; trading strategies; financial gateway platform; and MaxCompiler.
Keywords :
"Program compilers","Consumer electronics","Benchmark testing","Risk management","Technological innovation"
Publisher :
ieee
Conference_Titel :
Hot Chips 25 Symposium (HCS), 2013 IEEE
Type :
conf
DOI :
10.1109/HOTCHIPS.2013.7478312
Filename :
7478312
Link To Document :
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