Title :
Innovation envelope: Hot chips in blades
Author_Institution :
BladeSystem, USA
Abstract :
Presents a collection of slides covering the following topics: chip innovation; blade environment; preboot configuration environment; virtual connect; and virtual Ethernet port aggregation.
Keywords :
"Blades","Technological innovation","System-on-chip","Computer architecture","Market opportunities","Ethernet"
Conference_Titel :
Hot Chips 21 Symposium (HCS), 2009 IEEE
DOI :
10.1109/HOTCHIPS.2009.7478351
