Fabrication of typical 3D structure on LTCC for microsystem

Multilayer LTCC substrate can fulfill circuit miniaturization; meanwhile, its “brick-laying” fabrication manner provides feasibility for complicated 3D structures. Based on the traditional fabrication technology, this paper introduces the novel fabrication methods for two kinds of typical 3D structures on LTCC. For microfluidic structure, we choose applicable graphite-based sacrificial material. By adjusting the laminating and sintering parameters, preferable results can be obtained. For membrane embedded cavity structure, we proposed “sandwich” method, in which the LTCC membrane is protected by the high-temperature sandwich material. In such regime, the constraint-sintering is realized. In addition, depending on the protection of the sandwich material, the LTCC membrane with the flatness about 15μm is realized in the embedded cavity. The realization of the two kinds of 3D structure in LTCC substrate is meaningful for LTCC microsystem applications.