Pre-bond TSV testing method using Constant Current Source

We propose a novel pre-bond TSV test method that covers most of TSV defects before die stacking. The basic idea is to design a DfT structure to acquire the charging voltages of TSVs-under-test, which reflect the characteristics of the defects. The Constant Current Source (CCS) in the proposed structure can improve measurement accuracy and the combining of single-end test and probe-needle-grounding test makes our method has a better defect coverage with high resolution.