DocumentCode :
3779721
Title :
Trench capacitor using R.T.O. for MEGA bit DRAM´s
Author :
K. Yoneda;T. Taniguchi;H. Uchida;H. Okada;H. Oishi;Y. Miyai;M. Inoue
Author_Institution :
Kyoto Reserch Laboratory, Matsushita Electronics Corporation, 19, Nishikujo-Kasugacho, Minami-ku, Kyoto 601 Japan
fYear :
1987
fDate :
5/1/1987 12:00:00 AM
Firstpage :
95
Lastpage :
96
Abstract :
Electrical characteristics of trench capacitors by using R.T.O. process have been discussed. Trench capacitors with high field dielectric breakdown and low interface state density are obtained by using R.T.O. at high temperature (>1100 t). Degradation of time dependent dielectric breakdown and pause refresh time of 1M bit DRAM are also improved by this technique. This technique gives us thin oxide with high quality and reliability for trench capacitors and promise to realize the high performance mega-bit class DRAM.
Keywords :
"Capacitors","Oxidation","Random access memory","Films","Electric breakdown","Logic gates","Silicon"
Publisher :
ieee
Conference_Titel :
VLSI Technology, 1987. SymVLSITech 1987. Symposium on
Print_ISBN :
978-1-5090-3151-1
Type :
conf
Filename :
7508747
Link To Document :
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