Title :
Sub micron P-MOSFETs under static and swap stress
Author :
H.-M. M?hlhoff;P. Murkin;M. Orlowski;W. Weber;K.H. Kusters;W. M?ller;C. M. Rogers;H. Wendt
Author_Institution :
Corporate Research and Technology, Techn. Center for Microelectronics Siemens AG Otto-Hahn-Ring 6, 8000 Munich 83, West Germany
fDate :
5/1/1987 12:00:00 AM
Abstract :
It has been shown that current degradation of p-channel transistors is dependent on drain structure and it is lowest for maximum gate drain overlap. P-channel transistors show severe degradation when source and drain are reversed during stress (Swap stress). This poses an increased reliability risk for p-channel pass transistors and transfer gates in P-MOS DRAMS.
Keywords :
"Stress","Logic gates","Degradation","Transistors","MOSFET circuits","Electric fields","Substrates"
Conference_Titel :
VLSI Technology, 1987. SymVLSITech 1987. Symposium on
Print_ISBN :
978-1-5090-3151-1