• DocumentCode
    3780515
  • Title

    Analysis of crosstalk between cables on board in high speed EMUs

  • Author

    Xiaodong He; Yinghong Wen; Jinbao Zhang; Linsong Feng

  • Author_Institution
    Beijing Jiaotong University, Electromagnetic Compatibility Laboratory, China
  • fYear
    2015
  • Firstpage
    454
  • Lastpage
    457
  • Abstract
    Due to intensive cable arrangement in high speed EMUs, the work on crosstalk coupling between power lines to temperature sensor lines with groove is quite important. According to a specific cable arrangement on board in EMU, this paper deals with the influence of structure of groove, intersection angle and impedance of lines by electromagnetic simulation software which was based on Finite Difference Time Domain (FDTD). In the light of actual situation, using 110V sinusoidal voltage as excitation source of power line. The results suggested that the metal structure of groove can reduce the maximum crosstalk 13dB, the cover and clapboard of groove can also reduce some crosstalk. In addition, the crosstalk value declines with the intersection angle increased and impedance of cables decreased.
  • Keywords
    "Analytical models","Integrated circuit modeling","Electromagnetics","Medical services","Crosstalk"
  • Publisher
    ieee
  • Conference_Titel
    Microwave, Antenna, Propagation, and EMC Technologies (MAPE), 2015 IEEE 6th International Symposium on
  • Type

    conf

  • DOI
    10.1109/MAPE.2015.7510356
  • Filename
    7510356