DocumentCode
3780515
Title
Analysis of crosstalk between cables on board in high speed EMUs
Author
Xiaodong He; Yinghong Wen; Jinbao Zhang; Linsong Feng
Author_Institution
Beijing Jiaotong University, Electromagnetic Compatibility Laboratory, China
fYear
2015
Firstpage
454
Lastpage
457
Abstract
Due to intensive cable arrangement in high speed EMUs, the work on crosstalk coupling between power lines to temperature sensor lines with groove is quite important. According to a specific cable arrangement on board in EMU, this paper deals with the influence of structure of groove, intersection angle and impedance of lines by electromagnetic simulation software which was based on Finite Difference Time Domain (FDTD). In the light of actual situation, using 110V sinusoidal voltage as excitation source of power line. The results suggested that the metal structure of groove can reduce the maximum crosstalk 13dB, the cover and clapboard of groove can also reduce some crosstalk. In addition, the crosstalk value declines with the intersection angle increased and impedance of cables decreased.
Keywords
"Analytical models","Integrated circuit modeling","Electromagnetics","Medical services","Crosstalk"
Publisher
ieee
Conference_Titel
Microwave, Antenna, Propagation, and EMC Technologies (MAPE), 2015 IEEE 6th International Symposium on
Type
conf
DOI
10.1109/MAPE.2015.7510356
Filename
7510356
Link To Document