Analysis and validation of hybrid model for signal via structures in complex conditions

A hybrid model is proposed for signal structures of PCBs and packages. The stack-up structure can be decomposed into several types of different sub-structures: microstrip line-via transition structure, via structure and strip line-via transition structure. In order to get good result, the strip line-via transmission structure is analyzed by the improved matrix-penciled moment method, vias are modeled by the intrinsic via circuit model , whereas the strip line-via transitions are described by modal decomposition. Finally microwave network cascade method is used for get the result of the complete structure. Full-wave solver HFSS have been used to validate the method and good agreements have been observed.