Research on the transmission and coupling issue of multilayer TSV and multilayer TSV array

Since more chips are fabricated within 3D-IC, the single layer TSV cannot satisfy the requirement. Hence, the multilayer TSV structure was proposed, and the influence of different bump radius, bump height, underfill material in the intermetallic layer on the TSV performance was studied. In reality, multilayer TSV array is applied in the product. Therefore two multilayer 4 × 4 TSV arrays have been proposed with different GS distribution. The coupling analysis was performed and the effect of ground TSV was studied.