Title :
Research on the transmission and coupling issue of multilayer TSV and multilayer TSV array
Author :
Ting Kang; Zhaowen Yan; Wei Zhang; Jianwei Wang
Author_Institution :
School of Electronic and Information Engineering, Beihang University, China
Abstract :
Since more chips are fabricated within 3D-IC, the single layer TSV cannot satisfy the requirement. Hence, the multilayer TSV structure was proposed, and the influence of different bump radius, bump height, underfill material in the intermetallic layer on the TSV performance was studied. In reality, multilayer TSV array is applied in the product. Therefore two multilayer 4 × 4 TSV arrays have been proposed with different GS distribution. The coupling analysis was performed and the effect of ground TSV was studied.
Keywords :
"Couplings","Through-silicon vias","Silicon"
Conference_Titel :
Microwave, Antenna, Propagation, and EMC Technologies (MAPE), 2015 IEEE 6th International Symposium on
DOI :
10.1109/MAPE.2015.7510408