DocumentCode
3780875
Title
The effect of moisture and mold on the electrical properties of electronic hook-up wire insulations
Author
R. H. Luce;K. N. Mathes
Author_Institution
Department of Biology, Rensselaer Polytechnic Institute, Troy, N. Y.
fYear
1950
Firstpage
27
Lastpage
29
Abstract
Failure of electronic apparatus under conditions of high humidity and temperatures conducive to the growth of molds focused attention upon the role of molds in deterioration. Early investigation of this problem solely by cultural biological techniques resulted in extensive use of lacquers and varnishes containing fungicides as coatings for electronic equipment and components.
Keywords
"Insulation","Moisture","Humidity","Pollution measurement","Capacitance","Immune system","Cotton"
Publisher
ieee
Conference_Titel
Electrical Insulation, 1950 Conference On
Print_ISBN
978-1-5090-3127-6
Type
conf
DOI
10.1109/CEI.1950.7513598
Filename
7513598
Link To Document