DocumentCode :
3780875
Title :
The effect of moisture and mold on the electrical properties of electronic hook-up wire insulations
Author :
R. H. Luce;K. N. Mathes
Author_Institution :
Department of Biology, Rensselaer Polytechnic Institute, Troy, N. Y.
fYear :
1950
Firstpage :
27
Lastpage :
29
Abstract :
Failure of electronic apparatus under conditions of high humidity and temperatures conducive to the growth of molds focused attention upon the role of molds in deterioration. Early investigation of this problem solely by cultural biological techniques resulted in extensive use of lacquers and varnishes containing fungicides as coatings for electronic equipment and components.
Keywords :
"Insulation","Moisture","Humidity","Pollution measurement","Capacitance","Immune system","Cotton"
Publisher :
ieee
Conference_Titel :
Electrical Insulation, 1950 Conference On
Print_ISBN :
978-1-5090-3127-6
Type :
conf
DOI :
10.1109/CEI.1950.7513598
Filename :
7513598
Link To Document :
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