• DocumentCode
    3780875
  • Title

    The effect of moisture and mold on the electrical properties of electronic hook-up wire insulations

  • Author

    R. H. Luce;K. N. Mathes

  • Author_Institution
    Department of Biology, Rensselaer Polytechnic Institute, Troy, N. Y.
  • fYear
    1950
  • Firstpage
    27
  • Lastpage
    29
  • Abstract
    Failure of electronic apparatus under conditions of high humidity and temperatures conducive to the growth of molds focused attention upon the role of molds in deterioration. Early investigation of this problem solely by cultural biological techniques resulted in extensive use of lacquers and varnishes containing fungicides as coatings for electronic equipment and components.
  • Keywords
    "Insulation","Moisture","Humidity","Pollution measurement","Capacitance","Immune system","Cotton"
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation, 1950 Conference On
  • Print_ISBN
    978-1-5090-3127-6
  • Type

    conf

  • DOI
    10.1109/CEI.1950.7513598
  • Filename
    7513598