• DocumentCode
    3781352
  • Title

    Deep trench junction termination employing variable-K dielectric for high voltage devices

  • Author

    Huan Li;Xingbi Chen

  • Author_Institution
    State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology, Chengdu 610054, China
  • fYear
    2015
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    Deep trench junction termination employing variable-K (VK) dielectric for high voltage devices is proposed and studied. The device features 3 layers dielectric trench. The bottom of the trench is low-K dielectric (LK2), which is used to sustain the most reverse bias voltage. The top of the trench is high-K dielectric (HK), which forces most of the electric displacement lines via HK dielectric in the trench instead of the silicon drift layer. The middle layer is also low-K dielectric (LK1), which transmits part of the electric displacement lines in the LK2. A new electric field (E-field) peak introduced in the drift region next to the interface between LK1 and LK2 dielectric results in a more uniform E-field, compared with the device with low-K dielectric-filled trench (LKT). Numerical simulation shows that a diode with proposed junction termination reduces the termination width by 21%-77% compared with the LKT diode at the same breakdown voltage (BV).
  • Keywords
    "Dielectrics","Junctions","Permittivity","Electric breakdown","Silicon","Performance evaluation","Power semiconductor devices"
  • Publisher
    ieee
  • Conference_Titel
    ASIC (ASICON), 2015 IEEE 11th International Conference on
  • Print_ISBN
    978-1-4799-8483-1
  • Electronic_ISBN
    2162-755X
  • Type

    conf

  • DOI
    10.1109/ASICON.2015.7517157
  • Filename
    7517157