DocumentCode
3782655
Title
Architecture and performance of 3-dimensional SOI circuits
Author
Rongtian Zhang;K. Roy;D.B. Janes
Author_Institution
Purdue Univ., West Lafayette, IN, USA
fYear
1999
fDate
6/21/1905 12:00:00 AM
Firstpage
44
Lastpage
45
Abstract
In this paper, potential three-dimensional SOI CMOS VLSI circuit structures are laid out. Chip area, layout complexities, process costs, and impact on circuit performance are compared and discussed.
Keywords
"Silicon on insulator technology","Integrated circuit interconnections","Costs","Circuit optimization","Wire","Circuit synthesis","Buildings","CMOS technology","Semiconductor device measurement","Size measurement"
Publisher
ieee
Conference_Titel
SOI Conference, 1999. Proceedings. 1999 IEEE International
ISSN
1078-621X
Print_ISBN
0-7803-5456-7
Type
conf
DOI
10.1109/SOI.1999.819850
Filename
819850
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