• DocumentCode
    3783276
  • Title

    RIE of the polyimide micromechanical structures

  • Author

    L. Matay;I. Kostic;P. Hrkut;R. Andok

  • Author_Institution
    Inst. of Inf., Czechoslovak Acad. of Sci., Bratislava, Slovakia
  • fYear
    2000
  • Firstpage
    469
  • Lastpage
    473
  • Abstract
    Polyimides are commercially available materials which are widely used in various aspects of microelectronics. In this work, we show the use of a polyimide as a material suitable for the formation of micromechanical structures and its modification by reactive ion etching.
  • Keywords
    "Polyimides","Micromechanical devices","Plasma applications","Plasma materials processing","Plasma temperature","Dielectric materials","Inorganic materials","Dry etching","Building materials","Fabrication"
  • Publisher
    ieee
  • Conference_Titel
    Advanced Semiconductor Devices and Microsystems, 2000. ASDAM 2000. The Third International EuroConference on
  • Print_ISBN
    0-7803-5939-9
  • Type

    conf

  • DOI
    10.1109/ASDAM.2000.889547
  • Filename
    889547
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3783276