Title :
RIE of the polyimide micromechanical structures
Author :
L. Matay;I. Kostic;P. Hrkut;R. Andok
Author_Institution :
Inst. of Inf., Czechoslovak Acad. of Sci., Bratislava, Slovakia
Abstract :
Polyimides are commercially available materials which are widely used in various aspects of microelectronics. In this work, we show the use of a polyimide as a material suitable for the formation of micromechanical structures and its modification by reactive ion etching.
Keywords :
"Polyimides","Micromechanical devices","Plasma applications","Plasma materials processing","Plasma temperature","Dielectric materials","Inorganic materials","Dry etching","Building materials","Fabrication"
Conference_Titel :
Advanced Semiconductor Devices and Microsystems, 2000. ASDAM 2000. The Third International EuroConference on
Print_ISBN :
0-7803-5939-9
DOI :
10.1109/ASDAM.2000.889547
