Title :
Flip-chip flex-circuit packaging for 42 V/16 A integrated power electronics module applications
Author :
Xiao, Y. ; Natarajan, R. ; Chow, T.P. ; Rymaszewski, E.J. ; Gutmann, R.J.
Author_Institution :
Center for Power Electron. Syst., Rensselaer Polytech. Inst., Troy, NY, USA
Abstract :
This paper presents a novel flex-circuit power packaging platform that enables integration of power dies and control components with an advantageous form factor. The flex-circuit offers the benefits of planar interconnection and multilayer layout design flexibility with reduced parasitic inductance compared to conventional wire bonds. A half-bridge test vehicle that implements the flex-circuit packaging platform has been designed and fabricated for automotive applications (42 V, 16 A). The power flex module presents a compact configuration with electrical results indicating improved package parasitics
Keywords :
automotive electronics; bridge circuits; flip-chip devices; integrated circuit interconnections; integrated circuit packaging; power integrated circuits; 16 A; 42 V; automotive applications; control components; flip-chip flex-circuit packaging; form factor; half-bridge test vehicle; integrated power electronics module; planar interconnection; power dies; Electronics packaging; Flexible printed circuits; Heat sinks; Inductance; Integrated circuit interconnections; Power electronics; Substrates; Testing; Thermal conductivity; Wire;
Conference_Titel :
Applied Power Electronics Conference and Exposition, 2002. APEC 2002. Seventeenth Annual IEEE
Conference_Location :
Dallas, TX
Print_ISBN :
0-7803-7404-5
DOI :
10.1109/APEC.2002.989222
