Title :
Novel power MOSFET packaging technology doubles power density in synchronous buck converters for next generation microprocessors
Author :
Sawle, Andrew ; Blake, Carl ; Maric, D.
Author_Institution :
Int. Rectifier Corp., El Segundo, CA, USA
Abstract :
This paper introduces a novel power packaging technology developed by International Rectifier. This new packaging technology breaks ground in reducing package related losses and thus allowing designers to develop power supplies capable of meeting the demands of latest generation processors
Keywords :
DC-DC power convertors; losses; power MOSFET; power supplies to apparatus; semiconductor device packaging; thermal management (packaging); International Rectifier; conduction performance; current density; efficiency measurements; package related losses reduction; power MOSFET packaging technology; power density; power supplies development; reliability; synchronous buck converters; thermal performance; Buck converters; Cooling; MOSFET circuits; Packaging; Power MOSFET; Power supplies; Rectifiers; Silicon; Surface-mount technology; Transistors;
Conference_Titel :
Applied Power Electronics Conference and Exposition, 2002. APEC 2002. Seventeenth Annual IEEE
Conference_Location :
Dallas, TX
Print_ISBN :
0-7803-7404-5
DOI :
10.1109/APEC.2002.989234
