DocumentCode :
378336
Title :
An evaluation of board-mounted power module packages
Author :
Liang, Frank ; Wolf, Karl E. ; Thottuvelil, V. Joseph ; Alameel, George
Author_Institution :
MicroPower Div., Tyco Electron. Power Syst., Mesquite, TX, USA
Volume :
1
fYear :
2002
fDate :
2002
Firstpage :
112
Abstract :
We compare the characteristics of four BMP packages with a focus on thermal performance. Using experimental and simulation methods, the air-flow regime is found to be particularly important in determining which package provides superior thermal performance. For single-board medium-power designs, air flow velocities of less than 200 fpm allow potted modules to run cooler while air velocities greater than 400 fpm tend to allow open-frame modules to operate cooler. For dual-board designs, however, open-frame modules appear to outperform potted modules even at natural convection. Other attributes that are of interest to BMP users, such as cost, manufacturability, and ease of use, are discussed. We also propose a new method to obtain thermal derating characteristics of open-frame modules
Keywords :
modules; power convertors; thermal management (packaging); air flow velocities; air velocities; air-flow regime; board-mounted power module packages; cooler; cost; ease of use; manufacturability; natural convection; open-frame modules; potted modules; single-board medium-power designs; thermal derating characteristics; thermal performance; Computer applications; Computer architecture; Costs; DC-DC power converters; Electronic packaging thermal management; Manufacturing; Multichip modules; Power conversion; Power electronics; Power system simulation;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Applied Power Electronics Conference and Exposition, 2002. APEC 2002. Seventeenth Annual IEEE
Conference_Location :
Dallas, TX
Print_ISBN :
0-7803-7404-5
Type :
conf
DOI :
10.1109/APEC.2002.989235
Filename :
989235
Link To Document :
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