• DocumentCode
    3784122
  • Title

    Analogue integrated circuits electrothermal modelling

  • Author

    S. Bieganski;A. Napieralski

  • Author_Institution
    Dept.of Microelectron. & Comput. Sci., Tech. Uinversity of Lodz, Poland
  • fYear
    2001
  • fDate
    6/23/1905 12:00:00 AM
  • Firstpage
    143
  • Lastpage
    144
  • Abstract
    Recent models of electronic devices included in most popular simulation programs hardly simulate the thermal effects. It is possible only to set the fixed temperature of the entire die to consider the influence of equal temperature on the electric parameters of those devices. In this paper, a simple electrothermal modelling technique for analogue bipolar integrated circuits is presented.
  • Keywords
    "Electrothermal effects","Integrated circuit modeling","Temperature","Circuit simulation","Resistance heating","Thermal conductivity","Impedance","Artificial intelligence","Bipolar integrated circuits","Electric potential"
  • Publisher
    ieee
  • Conference_Titel
    CAD Systems in Microelectronics, 2001. CADSM 2001. Proceedings of the 6th International Conference. The Experience of Designing and Application of
  • Print_ISBN
    966-553-079-8
  • Type

    conf

  • DOI
    10.1109/CADSM.2001.975787
  • Filename
    975787
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3784122