• DocumentCode
    3784165
  • Title

    Implementation and prospects for chip-to-chip free-space optical interconnects

  • Author

    S.C. Esener

  • Author_Institution
    Sch. of Eng., Univ. of California, La Jolla, CA, USA
  • fYear
    2001
  • fDate
    6/23/1905 12:00:00 AM
  • Abstract
    This paper describes the state of the art in free space optical interconnects as applied to chip-to-chip communication. We will review various technologies that integrate micro lasers and optical detectors with silicon CMOS, provide optical link characteristics obtained with these devices, and discuss the capabilities of low cost and robust optoelectronic packaging techniques to seamlessly integrate optics and electronics at the board level.
  • Keywords
    "Optical interconnections","Space technology","CMOS technology","Optical detectors","Silicon","Optical fiber communication","Costs","Robustness","Electronics packaging","Integrated optics"
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting, 2001. IEDM ´01. Technical Digest. International
  • Print_ISBN
    0-7803-7050-3
  • Type

    conf

  • DOI
    10.1109/IEDM.2001.979564
  • Filename
    979564