DocumentCode
3784165
Title
Implementation and prospects for chip-to-chip free-space optical interconnects
Author
S.C. Esener
Author_Institution
Sch. of Eng., Univ. of California, La Jolla, CA, USA
fYear
2001
fDate
6/23/1905 12:00:00 AM
Abstract
This paper describes the state of the art in free space optical interconnects as applied to chip-to-chip communication. We will review various technologies that integrate micro lasers and optical detectors with silicon CMOS, provide optical link characteristics obtained with these devices, and discuss the capabilities of low cost and robust optoelectronic packaging techniques to seamlessly integrate optics and electronics at the board level.
Keywords
"Optical interconnections","Space technology","CMOS technology","Optical detectors","Silicon","Optical fiber communication","Costs","Robustness","Electronics packaging","Integrated optics"
Publisher
ieee
Conference_Titel
Electron Devices Meeting, 2001. IEDM ´01. Technical Digest. International
Print_ISBN
0-7803-7050-3
Type
conf
DOI
10.1109/IEDM.2001.979564
Filename
979564
Link To Document