Inter-chip optical interconnects using imaging fiber bundles and integrated CMOS detectors

Author

Rooman, C. ; Kuijk, M. ; Windisch, R. ; Vounckx, R. ; Borghs, G. ; Plichta, A. ; Brinkmann, M. ; Gerstner, K. ; Strack, R. ; Van Daele, P. ; Woittiez, W. ; Baets, R. ; Heremans, P.

Author_Institution

Vrije Univ., Brussels, Belgium

Volume

3

fYear

2001

fDate

2001

Firstpage

296

Abstract

We present a novel parallel optical link for inter-chip communication. The link consists of a high-performance LED array flip-chip mounted on CMOS drivers, an imaging fiber bundle and a standard CMOS detector/receiver array. The power consumption is 4 mW and 7.5 mW per channel at 300 Mbit/s and 700 Mbit/s, respectively. Each channel takes an area of merely 100 μm × 100 μm.

Keywords

CMOS digital integrated circuits; CMOS image sensors; flip-chip devices; integrated circuit interconnections; light emitting diodes; optical arrays; optical fibre communication; optical interconnections; 300 Mbit/s; 4 mW; 7.5 mW; 700 Mbit/s; high performance LED array flip-chip; imaging fiber bundles; integrated CMOS detectors; inter-chip optical interconnects; parallel optical link; power consumption; CMOS technology; Detectors; Integrated circuit interconnections; Light emitting diodes; Optical arrays; Optical fibers; Optical imaging; Optical interconnections; Optical receivers; Sensor arrays;

fLanguage

English

Publisher

ieee

Conference_Titel

Optical Communication, 2001. ECOC '01. 27th European Conference on

Print_ISBN

0-7803-6705-7

Type

conf

DOI

10.1109/ECOC.2001.989635

Filename

989635