DocumentCode
3784815
Title
Modeling, testing, and analysis for delay defects and noise effects in deep submicron devices
Author
Jing-Jia Liou;A. Krstic; Yi-Ming Jiang; Kwang-Ting Cheng
Author_Institution
Dept. of Electr. Eng., Nat. Tsing Hua Univ., Hsinchu, Taiwan
Volume
22
Issue
6
fYear
2003
Firstpage
756
Lastpage
769
Abstract
The performance of deep submicron designs can be affected by various parametric variations, manufacturing defects, noise or modeling errors that are all statistical in nature. In this paper, we propose a methodology to capture the effects of these statistical variations on circuit performance. It incorporates statistical information into timing analysis to compute the performance sensitivity of internal signals subject to a given type of defect, noise or variation sources. Next, we propose a novel path and segment selection methodology for delay testing based on the results of statistical performance sensitivity analysis. The objective of path/segment selection is to identify a small set of paths and segments such that the delay tests for the selected paths/segments guarantee the detection of performance failure. We apply the proposed path selection technique for selection of a set of paths for dynamic timing analysis considering power supply noise effects. Our experimental results demonstrate the difference in estimated circuit performance for the case when power supply noise effects are considered versus when these effects are ignored. Thus, they indicate the need for considering power supply noise effects on delays during path selection and dynamic timing analysis.
Keywords
"Delay effects","Circuit noise","Timing","Power supplies","Circuit optimization","Circuit testing","Virtual manufacturing","Information analysis","Signal analysis","Performance analysis"
Journal_Title
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
Publisher
ieee
ISSN
0278-0070
Type
jour
DOI
10.1109/TCAD.2003.811442
Filename
1201588
Link To Document