• DocumentCode
    3784815
  • Title

    Modeling, testing, and analysis for delay defects and noise effects in deep submicron devices

  • Author

    Jing-Jia Liou;A. Krstic; Yi-Ming Jiang; Kwang-Ting Cheng

  • Author_Institution
    Dept. of Electr. Eng., Nat. Tsing Hua Univ., Hsinchu, Taiwan
  • Volume
    22
  • Issue
    6
  • fYear
    2003
  • Firstpage
    756
  • Lastpage
    769
  • Abstract
    The performance of deep submicron designs can be affected by various parametric variations, manufacturing defects, noise or modeling errors that are all statistical in nature. In this paper, we propose a methodology to capture the effects of these statistical variations on circuit performance. It incorporates statistical information into timing analysis to compute the performance sensitivity of internal signals subject to a given type of defect, noise or variation sources. Next, we propose a novel path and segment selection methodology for delay testing based on the results of statistical performance sensitivity analysis. The objective of path/segment selection is to identify a small set of paths and segments such that the delay tests for the selected paths/segments guarantee the detection of performance failure. We apply the proposed path selection technique for selection of a set of paths for dynamic timing analysis considering power supply noise effects. Our experimental results demonstrate the difference in estimated circuit performance for the case when power supply noise effects are considered versus when these effects are ignored. Thus, they indicate the need for considering power supply noise effects on delays during path selection and dynamic timing analysis.
  • Keywords
    "Delay effects","Circuit noise","Timing","Power supplies","Circuit optimization","Circuit testing","Virtual manufacturing","Information analysis","Signal analysis","Performance analysis"
  • Journal_Title
    IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
  • Publisher
    ieee
  • ISSN
    0278-0070
  • Type

    jour

  • DOI
    10.1109/TCAD.2003.811442
  • Filename
    1201588