DocumentCode :
3784970
Title :
IC-integrated flexible shear-stress sensor skin
Author :
Yong Xu; Yu-Chong Tai;A. Huang; Chih-Ming Ho
Author_Institution :
Dept. of Electr. & Comput. Eng., Wayne State Univ. Detroit, MI, USA
Volume :
12
Issue :
5
fYear :
2003
Firstpage :
740
Lastpage :
747
Abstract :
This paper reports the successful development of the first IC-integrated flexible MEMS shear-stress sensor skin. The sensor skin is 1 cm wide, 2 cm long, and 70 /spl mu/m thick. It contains 16 shear-stress sensors, which are arranged in a 1-D array, with on-skin sensor bias, signal-conditioning, and multiplexing circuitry. We further demonstrated the application of the sensor skin by packaging it on a semicylindrical aluminum block and testing it in a subsonic wind tunnel. In our experiment, the sensor skin has successfully identified both the leading-edge flow separation and stagnation points with the on-skin circuitry. The integration of IC with MEMS sensor skin has significantly simplified implementation procedures and improved system reliability.
Keywords :
"Skin","Micromechanical devices","Packaging","Sensor arrays","Monolithic integrated circuits","Unmanned aerial vehicles","Sensor systems","Reliability","Actuators","Microelectromechanical devices"
Journal_Title :
Journal of Microelectromechanical Systems
Publisher :
ieee
ISSN :
1057-7157
Type :
jour
DOI :
10.1109/JMEMS.2003.815831
Filename :
1240146
Link To Document :
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