• DocumentCode
    3784970
  • Title

    IC-integrated flexible shear-stress sensor skin

  • Author

    Yong Xu; Yu-Chong Tai;A. Huang; Chih-Ming Ho

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Wayne State Univ. Detroit, MI, USA
  • Volume
    12
  • Issue
    5
  • fYear
    2003
  • Firstpage
    740
  • Lastpage
    747
  • Abstract
    This paper reports the successful development of the first IC-integrated flexible MEMS shear-stress sensor skin. The sensor skin is 1 cm wide, 2 cm long, and 70 /spl mu/m thick. It contains 16 shear-stress sensors, which are arranged in a 1-D array, with on-skin sensor bias, signal-conditioning, and multiplexing circuitry. We further demonstrated the application of the sensor skin by packaging it on a semicylindrical aluminum block and testing it in a subsonic wind tunnel. In our experiment, the sensor skin has successfully identified both the leading-edge flow separation and stagnation points with the on-skin circuitry. The integration of IC with MEMS sensor skin has significantly simplified implementation procedures and improved system reliability.
  • Keywords
    "Skin","Micromechanical devices","Packaging","Sensor arrays","Monolithic integrated circuits","Unmanned aerial vehicles","Sensor systems","Reliability","Actuators","Microelectromechanical devices"
  • Journal_Title
    Journal of Microelectromechanical Systems
  • Publisher
    ieee
  • ISSN
    1057-7157
  • Type

    jour

  • DOI
    10.1109/JMEMS.2003.815831
  • Filename
    1240146