DocumentCode
3784970
Title
IC-integrated flexible shear-stress sensor skin
Author
Yong Xu; Yu-Chong Tai;A. Huang; Chih-Ming Ho
Author_Institution
Dept. of Electr. & Comput. Eng., Wayne State Univ. Detroit, MI, USA
Volume
12
Issue
5
fYear
2003
Firstpage
740
Lastpage
747
Abstract
This paper reports the successful development of the first IC-integrated flexible MEMS shear-stress sensor skin. The sensor skin is 1 cm wide, 2 cm long, and 70 /spl mu/m thick. It contains 16 shear-stress sensors, which are arranged in a 1-D array, with on-skin sensor bias, signal-conditioning, and multiplexing circuitry. We further demonstrated the application of the sensor skin by packaging it on a semicylindrical aluminum block and testing it in a subsonic wind tunnel. In our experiment, the sensor skin has successfully identified both the leading-edge flow separation and stagnation points with the on-skin circuitry. The integration of IC with MEMS sensor skin has significantly simplified implementation procedures and improved system reliability.
Keywords
"Skin","Micromechanical devices","Packaging","Sensor arrays","Monolithic integrated circuits","Unmanned aerial vehicles","Sensor systems","Reliability","Actuators","Microelectromechanical devices"
Journal_Title
Journal of Microelectromechanical Systems
Publisher
ieee
ISSN
1057-7157
Type
jour
DOI
10.1109/JMEMS.2003.815831
Filename
1240146
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