DocumentCode

3785269

Title

EIC´s Message New challenges and burning issues

Author

P. Bose

Volume

24

Issue

1

fYear

2004

Firstpage

5

Lastpage

5

Keywords

"Temperature","Microprocessors","Feedback","Computer architecture","Roads","Microarchitecture","Abstracts","Resists","Packaging","Cooling"

Journal_Title

IEEE Micro

Publisher

ieee

ISSN

0272-1732

Type

jour

DOI

10.1109/MM.2004.1268971

Filename

1268971