DocumentCode :
3785269
Title :
EIC´s Message New challenges and burning issues
Author :
P. Bose
Volume :
24
Issue :
1
fYear :
2004
Firstpage :
5
Lastpage :
5
Keywords :
"Temperature","Microprocessors","Feedback","Computer architecture","Roads","Microarchitecture","Abstracts","Resists","Packaging","Cooling"
Journal_Title :
IEEE Micro
Publisher :
ieee
ISSN :
0272-1732
Type :
jour
DOI :
10.1109/MM.2004.1268971
Filename :
1268971
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=3785269
