Title :
Numerical Conformal Mapping for Treatment of Geometry Problems in Process Simulation
Author :
A. Seidl;M. Svoboda
Author_Institution :
Institute fur Festkorpertechnologie, Munich, Germany
Abstract :
In semiconductor modeling, partial differential equations often have to be solved on a domain with a curved boundary. A numerical conformal mapping well suited for process modeling problems is presented. Its use in connection with a moving boundary is explained.
Keywords :
"Conformal mapping","Geometry","Solid modeling","Partial differential equations","Boundary conditions","Mesh generation","Switches","Finite element methods","Shape","Closed-form solution"
Journal_Title :
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
DOI :
10.1109/TCAD.1985.1270138
