3785576

Low dielectric constant materials for IC applications [Book Review]

J.J. Shea

20

2

2004

53

54

"Book reviews","Dielectric constant","Dielectric materials","Application specific integrated circuits","Vibrations","Heat transfer","Integrated circuit interconnections","Copper","Chemical vapor deposition","Polymers"

IEEE Electrical Insulation Magazine

ieee

0883-7554

jour

10.1109/MEI.2004.1283280

1283280