• DocumentCode
    3785652
  • Title

    Foreword Contributions from the 11th Topical Meeting on Electrical Performance of Electronic Packaging

  • Author

    M. Nakhla;T. Rahal-Arabi

  • Volume
    27
  • Issue
    1
  • fYear
    2004
  • Firstpage
    2
  • Lastpage
    3
  • Keywords
    "Electronics packaging","Educational institutions","Circuits","Radio frequency","Power system modeling","Electromagnetic modeling","Meetings","Signal design","Signal analysis"
  • Journal_Title
    IEEE Transactions on Advanced Packaging
  • Publisher
    ieee
  • ISSN
    1521-3323
  • Type

    jour

  • DOI
    10.1109/TADVP.2004.828060
  • Filename
    1288263