3785652

Foreword Contributions from the 11th Topical Meeting on Electrical Performance of Electronic Packaging

M. Nakhla;T. Rahal-Arabi

27

1

2004

2

3

"Electronics packaging","Educational institutions","Circuits","Radio frequency","Power system modeling","Electromagnetic modeling","Meetings","Signal design","Signal analysis"

IEEE Transactions on Advanced Packaging

ieee

1521-3323

jour

10.1109/TADVP.2004.828060

1288263