DocumentCode
3785652
Title
Foreword Contributions from the 11th Topical Meeting on Electrical Performance of Electronic Packaging
Author
M. Nakhla;T. Rahal-Arabi
Volume
27
Issue
1
fYear
2004
Firstpage
2
Lastpage
3
Keywords
"Electronics packaging","Educational institutions","Circuits","Radio frequency","Power system modeling","Electromagnetic modeling","Meetings","Signal design","Signal analysis"
Journal_Title
IEEE Transactions on Advanced Packaging
Publisher
ieee
ISSN
1521-3323
Type
jour
DOI
10.1109/TADVP.2004.828060
Filename
1288263
Link To Document