3785654

Foreword Contributions from Thermal Investigations of ICs and Systems (THERMINIC)

C.J.M. Lasance;V. Szekely

27

1

2004

79

80

"Conferences","Packaging","Components, packaging, and manufacturing technology","Testing","Boundary conditions","Multichip modules","Temperature","Thermal conductivity","Thermal stresses","Stress measurement"

IEEE Transactions on Components and Packaging Technologies

ieee

1521-3331

jour

10.1109/TCAPT.2004.827946

1288308