• DocumentCode
    3786318
  • Title

    Introduction to the Special Issue on Interface Reliability II

  • Author

    R. Blish;A. Christou;G. Samuelson;B. Thomas

  • Volume
    4
  • Issue
    2
  • fYear
    2004
  • Firstpage
    127
  • Lastpage
    128
  • Keywords
    "Special issues and sections","Adhesives","Copper","Thermal stresses","Semiconductor device reliability","Delamination","Chemical technology","Tensile stress","Heating","Thermal expansion"
  • Journal_Title
    IEEE Transactions on Device and Materials Reliability
  • Publisher
    ieee
  • ISSN
    1530-4388
  • Type

    jour

  • DOI
    10.1109/TDMR.2004.831988
  • Filename
    1318615
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3786318