• DocumentCode
    3786345
  • Title

    Fluoroplastics, vol. 1 - non-melt processible fluoroplastics - Book Review

  • Author

    S. Ebnesajjad

  • Author_Institution
    Knovel Corporation
  • Volume
    20
  • Issue
    4
  • fYear
    2004
  • Firstpage
    47
  • Lastpage
    47
  • Keywords
    "Book reviews","Chip scale packaging","Sections","Wafer scale integration","Plastics","Mechanical factors","Electronics packaging","Integrated circuit packaging","Dielectric constant","Dielectric losses"
  • Journal_Title
    IEEE Electrical Insulation Magazine
  • Publisher
    ieee
  • ISSN
    0883-7554
  • Type

    jour

  • DOI
    10.1109/MEI.2004.1318853
  • Filename
    1318853
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3786345