DocumentCode :
3786521
Title :
Foreword Special Issue on System-On-Package (SOP)
Author :
R.R. Tummala
Volume :
27
Issue :
2
fYear :
2004
Firstpage :
239
Lastpage :
240
Keywords :
"Optical device fabrication","Electromagnetic interference","Electronics packaging","Signal design","Assembly","Pulp manufacturing","Moore´s Law","Transistors","Radio frequency","Optical sensors"
Journal_Title :
IEEE Transactions on Advanced Packaging
Publisher :
ieee
ISSN :
1521-3323
Type :
jour
DOI :
10.1109/TADVP.2004.828809
Filename :
1331505
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=3786521
