DocumentCode :
3786611
Title :
Devices and packaging for wireless communications
Volume :
5
Issue :
3
fYear :
2004
Firstpage :
95
Lastpage :
95
Keywords :
"Packaging","Wireless communication","Power system management","Technology management","Wafer scale integration","Bonding","Communications technology","Semiconductor device noise","Linearity","Computer displays"
Journal_Title :
IEEE Microwave Magazine
Publisher :
ieee
ISSN :
1527-3342
Type :
jour
DOI :
10.1109/MMW.2004.1337793
Filename :
1337793
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=3786611
