High performance piezoceramic films on substrates for high frequency imaging

Author

Levassort, F. ; Hue, L. P Tran Huu ; Holc, J. ; Bove, T. ; Kosec, M. ; Lethiecq, M.

Volume

2

fYear

2001

fDate

2001

Firstpage

1035

Abstract

PZT thick film fabrication process by screen-printing on two substrates (alumina and PZT) is first described. The firing temperature of the PZT layers is only 800°C since the composition was modified with lead germanate (PGO). This minimizes lead losses in films during sintering. The characterization of the samples considered as four layer elements (with electrodes) reveals high electromechanical performance of the films (thickness around 40 μm) since the measured thickness coupling factor is around 50%. The results are used to simulate single element high frequency transducers with a KLM model where the substrate is directly used as a backing for an integrated device

Keywords

lead compounds; piezoceramics; printing; sintering; thick films; ultrasonic imaging; ultrasonic transducers; 20 MHz; 40 micron; 800 degC; Al₂O₃; KLM model; PZT; PZT substrates; PZT thick film fabrication process; PZT-Al₂O₃; PbZrO3TiO3; PbZrO3TiO3-Al2O3; US imaging; alumina substrate; electromechanical performance; firing temperature; four layer elements; high frequency imaging; high performance piezoceramic films; screen printing; single element HF transducers; Electrodes; Fabrication; Firing; Frequency; Piezoelectric materials; Substrates; Temperature; Thick films; Thickness measurement; Transducers;

fLanguage

English

Publisher

ieee

Conference_Titel

Ultrasonics Symposium, 2001 IEEE

Conference_Location

Atlanta, GA

Print_ISBN

0-7803-7177-1

Type

conf

DOI

10.1109/ULTSYM.2001.991896

Filename

991896