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Foreword Special Section on EuroSimE

W.D. van Driel;X. Fan;K.G.Q. Zhang

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4

2004

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"Microelectronics","Electronic packaging thermal management","Electronics packaging","Mechanical engineering","Semiconductor device modeling","Analytical models","Thermomechanical processes","Semiconductor device packaging","Transactions Committee","Components, Packaging, and Manufacturing Technology Society"

IEEE Transactions on Components and Packaging Technologies

ieee

1521-3331

jour

10.1109/TCAPT.2004.838863

1362794