• DocumentCode
    3786984
  • Title

    Foreword Special Section on EuroSimE

  • Author

    W.D. van Driel;X. Fan;K.G.Q. Zhang

  • Volume
    27
  • Issue
    4
  • fYear
    2004
  • Firstpage
    627
  • Lastpage
    628
  • Keywords
    "Microelectronics","Electronic packaging thermal management","Electronics packaging","Mechanical engineering","Semiconductor device modeling","Analytical models","Thermomechanical processes","Semiconductor device packaging","Transactions Committee","Components, Packaging, and Manufacturing Technology Society"
  • Journal_Title
    IEEE Transactions on Components and Packaging Technologies
  • Publisher
    ieee
  • ISSN
    1521-3331
  • Type

    jour

  • DOI
    10.1109/TCAPT.2004.838863
  • Filename
    1362794
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3786984