DocumentCode :
3787084
Title :
Dielectric properties of porous media [Book Review]
Author :
J.J. Shea
Volume :
20
Issue :
6
fYear :
2004
Firstpage :
64
Lastpage :
64
Keywords :
"Book reviews","Dielectric materials","Conducting materials","Microelectronics","Thermal conductivity","Electric breakdown","Dielectric breakdown","Packaging","Assembly","Thin film circuits"
Journal_Title :
IEEE Electrical Insulation Magazine
Publisher :
ieee
ISSN :
0883-7554
Type :
jour
DOI :
10.1109/MEI.2004.1367524
Filename :
1367524
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=3787084