• DocumentCode
    3787462
  • Title

    Foreword

  • Author

    T. Rahal-Arabi

  • Volume
    28
  • Issue
    1
  • fYear
    2005
  • Firstpage
    2
  • Lastpage
    3
  • Keywords
    "Semiconductor device modeling","Electronics packaging","Frequency","Pulse measurements","Time measurement","Transmission line matrix methods","Dielectric materials","Dielectric measurements","Transmission line measurements","Integrated circuit interconnections"
  • Journal_Title
    IEEE Transactions on Advanced Packaging
  • Publisher
    ieee
  • ISSN
    1521-3323
  • Type

    jour

  • DOI
    10.1109/TADVP.2005.844413
  • Filename
    1391061
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3787462