DocumentCode :
3787492
Title :
Foreword to the Special Section of the Asian Green Electronics Conference (AGEC)
Author :
J. Liu;H. JorgenGriese;Y.C. Chan
Volume :
27
Issue :
4
fYear :
2004
Firstpage :
213
Lastpage :
214
Keywords :
"Consumer electronics","Electronics packaging","Components, Packaging, and Manufacturing Technology Society","Environmentally friendly manufacturing techniques","Lead","Materials science and technology","Soldering","Conductive adhesives","Components, packaging, and manufacturing technology","Books"
Journal_Title :
IEEE Transactions on Electronics Packaging Manufacturing
Publisher :
ieee
ISSN :
1521-334X
Type :
jour
DOI :
10.1109/TEPM.2005.844477
Filename :
1393082
Link To Document :
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