DocumentCode :
3787793
Title :
Thermal design of electronic circuit boards and packages [Book Review]
Author :
J.J. Shea
Volume :
21
Issue :
2
fYear :
2005
Firstpage :
56
Lastpage :
57
Keywords :
"Book reviews","Electronic packaging thermal management","Electronic circuits","Project management","Electronics packaging","Dielectric materials","Printed circuits","Assembly","Heat transfer","Equations"
Journal_Title :
IEEE Electrical Insulation Magazine
Publisher :
ieee
ISSN :
0883-7554
Type :
jour
DOI :
10.1109/MEI.2005.1412233
Filename :
1412233
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=3787793
